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Supra Sciences has signed agreements to partner with Crescent Scientific Pvt Ltd ( www.cspl.in) for distribution of its products in India, and with Acme Biosciences Inc.( www.acmeca.com ), for distribution of its products in North America.
PRODUCTS
SP - Sulfonic Acid Resin, MP
SP - Triethylamine Resin, MP
SP - Carbonate Resin, MP
SP - Borohydride Resin, MP
SP - Cyanoborohydride Resin, MP
SP - Thiophenol Resin, MP
SP - Thiourea Resin, MP
SP - Sulfonyl Chloride Resin, MP
SP - Aminopolyhydroxy Resin, MP
SP - Diisopropylethylamine Resin, MP
SP - Trisamine Resin, MP
SP - Hydrazide Resin, MP
SP - Tribromide Resin, MP
SP - Merrifield High Loaded Resin, MP
SP - Thiophenol Resin, MP Fine
SP - Thiourea Resin, MP - Fine
SP - Trisamine Resin, MP - Fine
SP - Thio - Silica
SP - Trisamine - Silica
SP - Thiourea - Silica
SP - TMT - Silica
SP - Aminopolyhydroxy Resin, MP - Fine
SP - Piperazine - Silica
SP - Piperazine Resin, MP
SP - TMT Resin, MP
SP - THIO – SILICA
PRODUCT:
SP - Thio - Silica, a thiol-functionalized silica gel.
 
APPLICATIONS:
  • SP-Thio-Silica has a silica supported thiol functional group.
  • It is a robust metal scavenger for a variety of metals including Pd, Pt, Cu, Ag and Pb under a wide range of conditions.
  • SP-Thio-Silica has been used in pharmaceutical processes up to the pilot plant scale.
  • It is our most versatile metal scavenger and is the preferred metal scavenger for Pd (II), Cu, Ag, and Hg.
  • Silica supported Thiol is a scavenger of electrophiles eg. Alkyl-, benzyl- and allyl- halides, acid chlorides, isocyanates.
PROPERTIES:
Colour:  Off white powder
Category:      Base and metal Scavenger
Loading:     1.0 - 1.2 mmol/g (based on Nitrogen, sulphur content)
Particle Size:  Avg 40 – 62 um
Typical Scavenging: 3-5 equiv relative to metal content, 1-4 h, room temperature
Compatible Solvents: Effective both in aqueous and non aqueous solutions.
   
REFERENCES:
  • dv. Synth. Catal., 346 (2004) 889
  • Org. Proc. Res. Dev., 13 (2009) 598
  • Org. Proc. Res. Dev., 12 (2008) 540
  • Chem. Commun., 13 (2000) 1145
 
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