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PRODUCTS
SP - Sulfonic Acid Resin, MP
SP - Triethylamine Resin, MP
SP - Carbonate Resin, MP
SP - Borohydride Resin, MP
SP - Cyanoborohydride Resin, MP
SP - Thiophenol Resin, MP
SP - Thiourea Resin, MP
SP - Sulfonyl Chloride Resin, MP
SP - Aminopolyhydroxy Resin, MP
SP - Diisopropylethylamine Resin, MP
SP - Trisamine Resin, MP
SP - Hydrazide Resin, MP
SP - Tribromide Resin, MP
SP - Merrifield High Loaded Resin, MP
SP - Thiophenol Resin, MP Fine
SP - Thiourea Resin, MP - Fine
SP - Trisamine Resin, MP - Fine
SP - Thio - Silica
SP - Trisamine - Silica
SP - Thiourea - Silica
SP - TMT - Silica
SP - Aminopolyhydroxy Resin, MP - Fine
SP - Piperazine - Silica
SP - Piperazine Resin, MP
SP - TMT Resin, MP
SP - TMT RESIN, MP
PRODUCT:
SP - TMT Resin, MP, a highly cross-linked polystyrene resin functionalized with a trimercaptotriazine end group.
 
APPLICATIONS:
  • SP-TMT Resin is a polymer bound equivalent of trimercaptotriazine.
  • The resin is designed to scavenge residual palladium from products derived from palladium-catalysed reactions.
  • The MP base copolymer is a robust, low swelling material, which makes it ideal for restricted volume environments.
  • Its unique pore structure provides greater access to the reaction sites resulting in faster reactions and higher recoveries.
  • SP-TMT-Resin has been found to be highly effective in reducing the concentrations of palladium in both aqueous and non-aqueous solutions.
PROPERTIES:
Resin Type:  Macroporous poly (styrene-co-divinylbenzene)
Loading:       3.4 – 3.0 mmol/g (Elemental nitrogen analysis)
Bead Size:    330-1225 microns, 15-50 mesh (>90% within)
Typical Scavenging: 3-5 equivalent of resin relative to the palladium content, for a period of 12-16 hours, room temperature.
Compatible Solvents: Polar and non polar solvents, including aqueous solvents.
 
REFERENCES:
  1. Ishihara, K et al.(2000), chem. let, 29, 1218
  2. Chen,C;Dagneau, P,;Grabowski, E.J. J,;Oballa, R,;O`Shea, P,;Prasit, P,; Robichaud, J,; Tillyer, R,; Wang, X. j.Org. chem. 2003, 68, 2633.
  3. Rosso, V.W.; Lust,D.A.; Bernot, P. J.;Grosso, J. A.; Modi, S. P.; Rusowicz, A.; sedergram, T.c.; Simpson, J. H.;Srivastava, S. K.; Humora,M. J.; Anderson, N. G. Org. Process Res & Dev. 1997, 1, 311.
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